Surface-mount assembly parameters and SMT throughput
0201
min component size
0.35mm
pitch BGA capability
85,000
components per hour
DFM & schematic verification
Solder paste printing & SPI
SMT placement & reflow
AOI & functional testing
High-precision stencil deposition paired with 3D solder paste inspection to guarantee volumetric consistency.
Multi-zone convection reflow profiling optimized for lead-free alloy compositions and thermal mass distribution.
Automated optical inspection, X-ray joint verification, and customized fixture-based functional testing.
Engineering review of Gerber files, stack-up parameters, and BOM optimization prior to tooling release.
Detailed assembly capabilities
Engineered for robust industrial deployment and rapid prototype validation.
High-speed SMT lines
Through-hole wave soldering
Firmware flashing & test
Modular placement heads handling complex fine-pitch ICs, BGAs, and micro-SMD components with closed-loop feedback.
Selective and dual-wave soldering systems configured for high-reliability mechanical connectors and power components.
In-system programming (ISP) and automated optical test fixtures integrated directly into the assembly line workflow.
Complete batch traceability on active silicon and passive inventory.
Submit your Gerber data and BOM files for direct technical review.